Intel Core Processors with Intel Hybrid Technology, code-named “Lakefield,” are the industry’s first product with Intel’s Foveros 3D stacking and a hybrid computing architecture. Leveraging Intel’s 10nm process technology and Tremont cores, Lakefield achieves a dramatic reduction in package area over previous generations of technology, offering OEMs more flexibility for thin-and-light form factor PCs while delivering uncompromised Windows 10 experiences.
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News
- Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens
- Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech
- Intel’s Project Athena, 10th Gen and Lakefield Drive ‘New Mobile Computing’ at Samsung Developer Conference
- Intel Introduces Tremont Microarchitecture
- Microsoft Unveils First Lakefield Device and New Surface Lineup with 10th Gen Intel Core
- At Hot Chips, Intel Pushes ‘AI Everywhere’
- 2019 Investor Meeting: Intel Previews Design Innovation; 10nm CPU Ships in June; 7nm Product in 2021
- 2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration
- Fact Sheet: New Intel Architectures and Technologies Target Expanded Market Opportunities
Press Materials
- Lakefield: Hybrid Cores in a 3D Package (Hot Chips 2019 presentation)
- “Innovations and the Compute Foundation” (Intel Press Conference, 2019 CES Presentation Slides)
Images
At CES 2019, Intel Corporation previews a new client platform code-named “Lakefield.” If features a hybrid CPU architecture with Intel’s Foveros 3D packaging technology. Lakefield has five cores, combining a 10nm high-performance Sunny Cove core with four Intel Atom processor-based cores into a tiny motherboard for thin and light devices packed with performance, long battery life and connectivity. Intel displays how its technology is the foundation for the world’s most important innovations and advances at CES 2019 from Jan. 8-11 in Las Vegas. (Credit: Intel Corporation)
Gregory Bryant, Intel senior vice president in the Client Computing Group, displays a “Lakefield” reference board during Intel Corporation’s news event at CES 2019 on Jan. 7, 2019, in Las Vegas. Lakefield features a hybrid CPU architecture with Intel’s Foveros 3D packaging technology. Intel displays how its technology is the foundation for the world’s most important innovations and advances at CES 2019 from Jan. 8-11 in Las Vegas. (Credit: Walden Kirsch/Intel Corporation)
Intel's mobile client platform, code-named “Lakefield,” introduces the industry’s first product with 3D stacking and hybrid computing architecture. Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield offers OEMs more flexibility for thin-and-light form factor PCs. (Credit: Intel Corporation)
Intel's mobile client platform, code-named “Lakefield,” introduces the industry’s first product with 3D stacking and hybrid computing architecture. Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield offers OEMs more flexibility for thin-and-light form factor PCs. (Credit: Intel Corporation)