Squeezing billions of tiny transistors onto ever-smaller computer chips requires one of the most complex manufacturing processes humans have devised. A fully equipped new fab costs about $10 billion and takes 6,000 construction workers about three years to complete. Intel’s manufacturing operations operate at a mega-scale worldwide, requiring a global supply chain that stretches across multiple continents.
News
- New Mexico, USA: Intel Opens Fab 9 in New Mexico
- Oregon, USA: Intel's Oregon Investments Fuel US Silicon Innovation Leadership
- Ireland: Intel’s New Fab in Ireland Begins High-Volume Production of Intel 4 Technology
- Poland: Intel Plans Assembly and Test Facility in Poland
- Ohio, USA: Intel Announces Next US Site with Landmark Investment in Ohio | Intel Invests in Ohio (Press Kit)
- Ireland: Ireland Milestone: First Tool Roll-in at Fab 34
- Worldwide: All Intel Manufacturing News
- United States: Competitiveness is at Stake for Chip Manufacturing (Bruce Andrews Editorial)
- Worldwide: Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing, Innovation and Product Leadership
- Arizona, USA: Intel Breaks Ground on Two New Leading Edge Chip Factories in Arizona
- New Mexico, USA: Intel Invests $3.5 Billion in New Mexico Operations (Press Kit)
Global Investments
B-roll Video
Manufacturing in Vietnam
Intel Manufacturing in Vietnam (B-Roll)
B-roll video footage shows the Vietnam Assembly Test (VNAT) facility in April 2023. (Credit: Intel Corporation)
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Manufacturing in Malaysia
Intel Manufacturing in Penang, Malaysia (B-Roll)
Video footage from April 2023 shows the Intel Penang Assembly Test (PGAT) facility in Penang, Malaysia. It includes Intel employees inside the facility and video of Intel Core Ultra processors, code-named Meteor Lake. (Credit: Intel Corporation)
Download video: "Intel Manufacturing in Penang, Malaysia (B-Roll)"
Manufacturing in Oregon, USA
A photo from November 2021 shows employees in cleanroom "bunny suits" working at Intel's D1X factory in Hillsboro, Oregon. A D1X fab expansion due for completion in 2022 will help meet a sharply increasing global demand for semiconductors. Intel's chip-manufacturing operation in Oregon is the company's biggest site worldwide. The company's 21,000 employees in Oregon make Intel the state's single largest private employer. (Credit: Walden Kirsch/Intel Corporation)
A photo from November 2021 shows employees in cleanroom "bunny suits" working at Intel's D1X factory in Hillsboro, Oregon. A D1X fab expansion due for completion in 2022 will help meet a sharply increasing global demand for semiconductors. Intel's chip-manufacturing operation in Oregon is the company's biggest site worldwide. The company's 21,000 employees in Oregon make Intel the state's single largest private employer. (Credit: Walden Kirsch/Intel Corporation)
A photo from November 2021 shows employees in cleanroom "bunny suits" working at Intel's D1X factory in Hillsboro, Oregon. A D1X fab expansion due for completion in 2022 will help meet a sharply increasing global demand for semiconductors. Intel's chip-manufacturing operation in Oregon is the company's biggest site worldwide. The company's 21,000 employees in Oregon make Intel the state's single largest private employer. (Credit: Walden Kirsch/Intel Corporation)
A photo from November 2021 shows employees in cleanroom "bunny suits" working at Intel's D1X factory in Hillsboro, Oregon. A D1X fab expansion due for completion in 2022 will help meet a sharply increasing global demand for semiconductors. Intel's chip-manufacturing operation in Oregon is the company's biggest site worldwide. The company's 21,000 employees in Oregon make Intel the state's single largest private employer. (Credit: Walden Kirsch/Intel Corporation)
The Intel Logo is displayed inside the lobby of Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. Oregon is home to Intel's biggest chip manufacturing operation worldwide. The company is the state's single largest private employer. (Credit: Intel Corporation)
A walkway connects Gordon Moore Park at Ronler Acres in Hillsboro, Oregon, to nearby parking facilities. Oregon is home to Intel's biggest chip manufacturing operation worldwide. The company is the state's single largest private employer. (Credit: Intel Corporation)
A photo shows the Moore Center at Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. The state is home to Intel's biggest chip manufacturing operation worldwide. The company is Oregon's single largest private employer. (Credit: Intel Corporation)
Automated Material-Handling System
Travel Intel’s Autonomous Superhighway
It has more than 27 miles of multilevel thoroughfares on which 1,700 autonomous vehicles shuttle Intel’s most precious cargo. It’s the automated material-handling system – or AMHS – at Intel’s D1 factory in Hillsboro, Oregon. Intel runs overhead transport systems like this in every one of its six chip fabs worldwide. The boxes scooting along on the overhead tracks are front-opening unified pods – or FOUPs – that carry as many as 25 wafers, each containing hundreds of Intel® chips, on their weekslong fabrication journey starting as blank silicon discs.
Oregon’s wafer superhighway connects nine buildings, including the D1X and D1D factories. The two factories together are a little larger than 12 U.S. football fields. Take a quick 2-minute tour around Oregon’s D1 factory — captured before pandemic recommendations for social distancing took effect — to learn more about what AMHS leader Mutaz Haddadin calls the “heartbeat and blood flow of the fab.”
» View video: Intel’s Automated Superhighway: ‘The Heartbeat and Blood Flow of the Fab’
Manufacturing in New Mexico, USA
A drone photo shows Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks to Intel New Mexico employees on Wednesday, Jan. 24, 2024, at the company’s Rio Rancho campus. Attendees include (from left) Rio Rancho Mayor Greggory Hull, Sandoval County Commission Chairman David Heil, U.S. Rep. Teresa Leger Fernández, and U.S. Rep. Melanie Stansbury. (Credit: Intel Corporation)
Keyvan Esfarjani (center), Intel chief global operations officer, cuts the ribbon in the ceremonial opening of Fab 9 in Rio Rancho, New Mexico, on Wednesday, Jan. 24, 2024. He is joined at an employee celebration with local elected officials and Intel managers (from left): Rio Rancho Mayor Greggory Hull; Ali Diouf, Fab 9 factory manager; U.S. Rep. Teresa Leger Fernández; Sandoval County Commission Chairman David Heil; U.S. Rep. Melanie Stansbury; New Mexico Gov. Michelle Lujan Grisham; Esfarjani; Katie Prouty, Intel New Mexico plant manager; Peter Charvat, general manager of Disaggregation Manufacturing Organization; Brian Chavez, F11x factory manager; Mindy Koch, New Mexico Corporate Services site manager; and Kenneth Nava, New Mexico director of Fab Construction Enterprise. (Credit: Intel Corporation)
Manufacturing technicians work in the clean room of Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
A manufacturing technician looks through a window of advanced packaging equipment at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
A photo from January 2024 at Intel's new Fab 9 in Rio Rancho, New Mexico shows chiplet bonding as part of Intel's advanced packaging technology called Foveros. This breakthrough 3D packaging technology offers flexible options for combining multiple chips that are optimized for power, performance and cost. (Credit: Intel Corporation)
A wafer moves through the manufacturing process at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
In January 2024, an Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a small wafer containing Intel silicon photonics chips. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
An Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a bond module carrier containing a single silicon photonics chip in January 2024. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
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Manufacturing in Arizona, USA
Intel’s Fab 42: A Peek Inside One of the World’s Most Advanced Factories
One of the largest construction projects in the U.S. with almost 6,000 workers is underway on Intel’s Ocotillo campus in Arizona. Intel is outfitting Fab 42 with 1,300 tools (many of them requiring multiple trucks to move), a super overhead highway that zips silicon wafers around all four of the company’s Arizona factories, and a 12-acre water plant that will treat 9.1 million gallons of wastewater a day.
» View video: Intel's Fab 42: A Peek Inside One of the World’s Most Advanced Factories
» View/Download video: Ocotillo, Arizona, Fab 42 Construction (B-Roll)
» View/Download video: Intel Manufacturing Day 2020 from Arizona’s Fab 42 (B-Roll)
Industry-Leading Glass Substrates
An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
A photo shows glass substrate test units at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
An Intel engineer working on a glass core substrate lithography resist stripping tool at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
A photo shows the ball grid array side of an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
A photo shows the multi die assembly side of an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
Hamid Azimi, corporate vice president and director of substrate technology development at Intel Corporation, holds an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
Hamid Azimi, corporate vice president and director of substrate technology development at Intel Corporation, holds an Intel assembled glass substrate test chip at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)
Video footage from July 2023 shows glass substrate tools and test units in Intel’s Assembly and Test Technology Development factories in Chandler, Arizona. In the factories, technicians build multi-chip packages that include substrates, computer chips and heat spreaders. Intel is leading the industry with a future generation of substrates made of glass, which will enable power improvements and transistor scaling to continue Moore’s Law. Intel delivers industry-leading packaging breakthroughs that enable performance, cost and scaling benefits for Intel and Intel Foundry Services customers. (Credit: Intel Corporation)
Intel’s Masking Operation
Intel Mask Operation: An Inside Look at a Critical Manufacturing Step
Around the corner from Intel’s Santa Clara, California, headquarters is an unassuming building that houses a critically important step in the process of manufacturing chips: the Intel Mask Operation.
What’s a mask? It’s a six-by-six-inch piece of quartz, a quarter-inch thick, that is used as the template to print circuitry onto a silicon wafer. To create a mask, engineers use computerized drawings from chip designers that are the blueprints for Intel processors and their billions of transistors.
Without the Intel Mask Operation, the company’s factories in Oregon, Arizona, Ireland and Israel would be unable to create a single processor. It takes 70 flawless masks to print the many layers of a single Intel 14nm die.
» View video: Intel Mask Operation: An Inside Look at a Critical Manufacturing Step
» View/Download video: The Intel Mask Operation (B-Roll)
An Intel engineer inspects a mask as part of the Intel Mask Operation in Santa Clara, California. The mask operation team builds the masks used as the templates to print circuitry onto a silicon wafer. To create a mask, engineers use computerized drawings that are the blueprints for Intel processors and their billions of transistors. (Credit: Tim Herman/Intel Corporation)
The Intel Mask Operation in Santa Clara, California, builds the masks used as the templates to print circuitry onto a silicon wafer. To create a mask, engineers use computerized drawings that are the blueprints for Intel processors and their billions of transistors. (Credit: Tim Herman/Intel Corporation)