In a webcast on Friday, Sept. 9, President Joe Biden joined Intel CEO Pat Gelsinger in Licking County, Ohio, to celebrate breaking ground on Intel’s newest U.S. manufacturing site in 40 years. In January, Intel announced an investment of more than $20 billion in the new semiconductor manufacturing site to produce leading-edge chips.
President Biden delivered remarks on rebuilding American manufacturing through the CHIPS and Science Act and the Bipartisan Infrastructure Law. Ohio Gov. Mike DeWine and other federal, state and local officials also took part in the event.
More Details: Intel Invests in Ohio (Press Kit)