Device Design Guidelines: Agilex™ 5 FPGAs and SoCs

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ID 813741
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 Device Design Guidelines 2. System Specification 3. Device Selection 4. Design Entry 5. Board and Software consideration 6. Design Implementation, Analysis, Optimization and Verification 7. Debugging
1. Introduction to Agilex™ 5 Device Design Guidelines x
1.1. Introduction to Agilex™ 5 Device Design Guide Revision History
2. System Specification x
2.1. Design Specification 2.2. Install Quartus® Prime Software 2.3. IP selection 2.4. Simulation 2.5. Preparing for Design Entry 2.6. I/O Summary 2.7. Using SDM in your devices 2.8. System Specification Revision History
2.3. IP selection x
2.3.1. IP cores 2.3.2. HPS IP
2.3.1. IP cores x
2.3.1.1. Interface Protocol IP cores
2.4. Simulation x
2.4.1. RTL Simulation 2.4.2. Simics® Simulator
2.5. Preparing for Design Entry x
2.5.1. Coding Styles and Design Recommendation 2.5.2. Platform Designer
3. Device Selection x
3.1. Device Variant 3.2. Device Selection Revision History
3.1. Device Variant x
3.1.1. Speed Grade and Package 3.1.2. Power option 3.1.3. Device Migration within Agilex™ 5 3.1.4. PLL 3.1.5. Logic element, Embedded memory, and DSP 3.1.6. I/O and LVDS SERDES 3.1.7. MIPI D-DPHY 3.1.8. Transceiver 3.1.9. Hard Processor System
4. Design Entry x
4.1. Design entry for FPGA 4.2. Design entry for Nios® V 4.3. Design entry for HPS 4.4. Design Entry Revision History
4.1. Design entry for FPGA x
4.1.1. Configuration Consideration Configuration Sources GUIDELINE: When configuring FPGA from flash, select a compatible QSPI device. GUIDELINE: Select the QSPI device that fits your design. Using a larger device allows for increases in the design bitstream size. GUIDELINE: Connect the serial flash or quad SPI flash reset pin to the AS_nRST pin. Configuration Clock GUIDELINE: In the Quartus® Prime Pro Edition GUI, select the configuration clock speed to match the capabilities of the QSPI flash device that you selected. System Reset Considerations Remote System Update 4.1.2. I/O and LVDS SERDES 4.1.3. PLL and Clock Planning 4.1.4. EMIF 4.1.5. Transceiver Planning 4.1.6. Sensors 4.1.7. MIPI D-PHY
4.1.1. Configuration Consideration x
Configuration Sources GUIDELINE: When configuring FPGA from flash, select a compatible QSPI device. GUIDELINE: Select the QSPI device that fits your design. Using a larger device allows for increases in the design bitstream size. GUIDELINE: Connect the serial flash or quad SPI flash reset pin to the AS_nRST pin. Configuration Clock GUIDELINE: In the Quartus® Prime Pro Edition GUI, select the configuration clock speed to match the capabilities of the QSPI flash device that you selected. System Reset Considerations Remote System Update 4.1.1.1. Partial Reconfiguration 4.1.1.2. SEU
4.1.2. I/O and LVDS SERDES x
4.1.2.1. Making FPGA Pin Assignments Checklist 4.1.2.2. Early Pin Planning and I/O Assignment Analysis for the FPGA Device 4.1.2.3. Agilex™ 5 I/O Features and Pin Connections
4.1.2.3. Agilex™ 5 I/O Features and Pin Connections x
4.1.2.3.1. I/O Signaling Type 4.1.2.3.2. Selectable Standards and Flexible I/O Banks 4.1.2.3.3. Agilex™ 5 Dual-Purpose and Special Pin Connections 4.1.2.3.4. Agilex™ 5 I/O Features
4.1.3. PLL and Clock Planning x
4.1.3.1. Clock and PLL Selection 4.1.3.2. PLL Feature Guidelines 4.1.3.3. Clock Feedback Mode 4.1.3.4. Clock Outputs 4.1.3.5. Clock Control Features
4.1.6. Sensors x
4.1.6.1. Voltage sensor 4.1.6.2. Temperature Sensor and Temperature Diode
4.3. Design entry for HPS x
4.3.1. Simics® Simulator 4.3.2. HPS IP Instantiation in Quartus® Prime
5. Board and Software consideration x
5.1. Early Board Planning 5.2. Boundary Scan for FPGA and HPS 5.3. Pin Connection Considerations for Board Design 5.4. Planning for Device Configuration 5.5. Board and Software Consideration Revision History
5.1. Early Board Planning x
5.1.1. Power - SmartVID or Fix Voltage 5.1.2. Thermal Management and Design
5.1.1. Power - SmartVID or Fix Voltage x
5.1.1.1. Intel® FPGA Power and Thermal Calculator 5.1.1.2. Power-Up and Power-Down Sequencing
5.3. Pin Connection Considerations for Board Design x
5.3.1. Board-Related Quartus® Prime Settings 5.3.2. Signal Integrity Considerations 5.3.3. Board-Level Simulation and Advanced I/O Timing Analysis
5.3.1. Board-Related Quartus® Prime Settings x
5.3.1.1. Unused Pins
5.3.2. Signal Integrity Considerations x
5.3.2.1. High-Speed Board Design 5.3.2.2. Simultaneous Switching Noise 5.3.2.3. I/O Termination
5.4. Planning for Device Configuration x
5.4.1. Device Power Cycling and Reconfiguration 5.4.2. Configuration Scheme Selection 5.4.3. Configuration Features 5.4.4. Quartus® Prime Configuration Settings 5.4.5. Configuration Pin Connections 5.4.6. JTAG Pins 5.4.7. MSEL Configuration Mode Pins 5.4.8. Other Configuration Pins
5.4.2. Configuration Scheme Selection x
5.4.2.1. Serial Configuration Devices 5.4.2.2. Intel® FPGA Download Cable II
5.4.4. Quartus® Prime Configuration Settings x
5.4.4.1. Optional Configuration Pins 5.4.4.2. Dual Purpose Configuration Pins
5.4.5. Configuration Pin Connections x
5.4.5.1. Configuration Pin Voltage Level 5.4.5.2. Clock Trace Signal Integrity
5.4.6. JTAG Pins x
5.4.6.1. JTAG Pin Connections 5.4.6.2. JTAG Signal Buffering 5.4.6.3. Download Cable Operating Voltage
6. Design Implementation, Analysis, Optimization and Verification x
6.1. Synthesis Tool 6.2. Device Resource Reports 6.3. Quartus® Prime Message 6.4. Design Assistant Design Rule Checking 6.5. Timing Constraints and Analysis 6.6. Area and Timing Optimization 6.7. Preserving Performance and Reducing Compilation Time 6.8. Designing with Hyperflex® 6.9. Simulation 6.10. Power Analysis 6.11. Design Implementation, Analysis, Optimization and Verification Revision History
6.5. Timing Constraints and Analysis x
6.5.1. Recommended Timing Optimization and Analysis Assignments 6.5.2. SDC-on-RTL and Post-Synthesis Static Timing Analysis
7. Debugging x
7.1. On-Chip Debug Overview 7.2. On-Chip Debugging Tools 7.3. Debugging Revision History
1. Introduction to Agilex™ 5 Device Design Guidelines
2. System Specification
3. Device Selection
4. Design Entry
5. Board and Software consideration
6. Design Implementation, Analysis, Optimization and Verification
7. Debugging

4.1.1. Configuration Consideration

The SDM in all Agilex™ 5 devices has a BootROM which loads the initial FPGA configuration bitstream. Once the initial configuration bitstream or firmware is loaded, the SDM continues to load the rest of the bitstream which contains the I/O and core fabric sections. For Agilex™ 5 SoC devices, this bitstream also contains the HPS First Stage Bootloader (FSBL) binary.

Configuration Sources

The initial FPGA configuration and the HPS FSBL are part of the initial configuration bitstream and the full bitstream can be obtained from several sources:
  • Avalon® -ST Data Source: An external Avalon® -ST master provides the bitstream.
  • JTAG Interface: An external JTAG master (usually driven by a host tool) provides the bitstream.
  • SDM Flash: A flash device connected on SDM side provides the bitstream.

GUIDELINE: When configuring FPGA from flash, select a compatible QSPI device.

GUIDELINE: Select the QSPI device that fits your design. Using a larger device allows for increases in the design bitstream size.

GUIDELINE: Connect the serial flash or quad SPI flash reset pin to the AS_nRST pin.

The SDM must fully control the QSPI reset. Do not connect the quad SPI reset pin to any external host.

Configuration Clock

GUIDELINE: In the Quartus® Prime Pro Edition GUI, select the configuration clock speed to match the capabilities of the QSPI flash device that you selected.

System Reset Considerations

Table 14.  System Reset Checklist
Number Done? Checklist Item
1   Intel strongly recommends using the Reset Release IP in your design to hold your design in reset until configuration is complete and to provide a known initialized state for your logic to begin operation. The Reset Release IP is described in the Device Configuration User Guide: Agilex™ 5 FPGAs and SoCs

Remote System Update

All Agilex™ 5 devices supports the Remote System Update (RSU) feature. When you use this feature, you have the option to store multiple application images alongside a failsafe factory image on the external SDM flash. Upon exiting POR, SDM attempts to load the application images in your specific sequence. If all the application images fail to load, then the failsafe factory image is loaded.

For more information Device Configuration User Guide: Agilex™ 5 FPGAs and SoCs .


Section Content
Partial Reconfiguration
SEU

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