Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

Download PDF
ID 683780
Date 6/14/2022
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Intel Agilex General-Purpose I/O Overview 2. Intel® Agilex™ General-Purpose I/O Banks 3. Intel® Agilex™ HPS I/O Banks 4. Intel® Agilex™ SDM I/O Banks 5. Intel® Agilex™ I/O Troubleshooting Guidelines 6. Intel® Agilex™ General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide 9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
1. Intel Agilex General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel® Agilex™ General-Purpose I/O Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. Intel® Agilex™ I/O Termination 2.5. Intel® Agilex™ GPIO Design Guidelines 2.6. I/O Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. I/O Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. Intel® Agilex™ I/O Termination x
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. Intel® Agilex™ GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. I/O Simulation x
2.6.1. IBIS Models 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Intel® Agilex™ HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. Intel® Agilex™ HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. Intel® Agilex™ HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel® Agilex™ SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. Intel® Agilex™ SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Intel® Agilex™ Configuration Pins
4.3. Intel® Agilex™ SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. Intel® Agilex™ General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Intel® Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Intel Agilex General-Purpose I/O Overview
2. Intel® Agilex™ General-Purpose I/O Banks
3. Intel® Agilex™ HPS I/O Banks
4. Intel® Agilex™ SDM I/O Banks
5. Intel® Agilex™ I/O Troubleshooting Guidelines
6. Intel® Agilex™ General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

6.2.4. OCT Intel® FPGA IP Signals

Table 59.  Input Interface SignalsIn the table, n represents the number of OCT blocks defined in the Number of OCT blocks parameter. The width of each signal is one per OCT block.
Signal Name Direction Description
rzqin[n:0] Input

Input connection from RZQ pad to the OCT block. RZQ pad is connected to an external resistance. The OCT block uses impedance connected to the rzqin port as a reference to generate the calibration code.

This signal is available for power-up and user modes.
calibration_request[n:0] Input

Set to 1 to request the OCT block to start calibration. Hold the signal for at least 2 ms or until ack_recal is set to 1.

This signal is only available for user mode.
ack_recal[n:0] Output

When set to 1 indicates OCT block is ready for calibration. There should be no calibration activities from the core to the OCT block until this signal is asserted for every calibration request.

This signal is only available for user mode.
ser_data_n Output

Transfer serial output calibration data from OCT block to I/O buffer.
Related Information
Level Two Title