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1.1. Comparison of the EPE and the Intel® Quartus® Prime Power Analyzer
1.2. Power Estimations and Design Requirements
1.3. Power Analyzer Walkthrough
1.4. Inputs for the Power Analyzer
1.5. Power Analysis in Modular Design Flows
1.6. Power Analyzer Compilation Report
1.7. Scripting Support
1.8. Power Analysis Revision History
1.4.2.1. Waveforms from Supported Simulators
1.4.2.2. .vcd Files from Third-Party Simulation Tools
1.4.2.3. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation
1.4.2.4. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities
1.4.2.5. Signal Activities from User Defaults Only
1.5.1. Complete Design Simulation
1.5.2. Modular Design Simulation
1.5.3. Multiple Simulations on the Same Entity
1.5.4. Overlapping Simulations
1.5.5. Partial Simulations
1.5.6. Node Name Matching Considerations
1.5.7. Glitch Filtering
1.5.8. Node and Entity Assignments
1.5.9. Default Toggle Rate Assignment
1.5.10. Vectorless Estimation
2.5.1. Clock Power Management
2.5.2. Pipelining and Retiming
2.5.3. Architectural Optimization
2.5.4. I/O Power Guidelines
2.5.5. Memory Optimization (M20K/MLAB)
2.5.6. DDR Memory Controller Settings
2.5.7. DSP Implementation
2.5.8. Reducing High-Speed Tile (HST) Usage
2.5.9. Unused Transceiver Channels
2.5.10. Periphery Power reduction XCVR Settings
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2.1.1. Design Activity and Power Analysis
Power consumption of a device also depends on the design's activity over time. Static power (PSTATIC) is the thermal power that a chip dissipates independent of user clocks. PSTATIC includes leakage power from all FPGA functional blocks, except for I/O DC bias power and transceiver DC bias power, which are accounted for in the I/O and transceiver sections. Dynamic power is the additional power consumption of a device due to signal activity or switching.