Agilex™ 7 Power Distribution Network Design Guidelines

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ID 683393
Date 10/18/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 Power Distribution Network Design Guidelines Overview 2. Power Delivery Overview 3. Board Power Delivery Network Recommendations 4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails 5. PCB PDN Design Guideline for Unused Tiles 6. PCB Voltage Regulator Recommendation for PCB Power Rails 7. Board Power Delivery Network Simulations 8. Agilex™ 7 Device Family PDN Design Summary 9. Document Revision History for the Agilex™ 7 Power Distribution Network Design Guidelines
1. Agilex™ 7 Power Distribution Network Design Guidelines Overview x
1.1. Device Guidelines Status for Agilex™ 7 Devices
2. Power Delivery Overview x
2.1. Power Architecture 2.2. Rail Merger Requirements 2.3. Power Rails Specification 2.4. Decoupling Capacitors Recommendation
2.1. Power Architecture x
2.1.1. Power Budget 2.1.2. Power Tree
2.1.2. Power Tree x
2.1.2.1. Recommended Power Tree for the Agilex™ 7 Devices with only P-Tile and E-Tile in the Device Packages 2.1.2.2. Recommended Power Tree for the Agilex™ 7 AGI or AGF (with only F-Tile, or both F-Tile and R-Tile) Device Packages 2.1.2.3. Recommended Power Tree for the Agilex™ 7 AGM (with only F-Tile, or both F-Tile and R-Tile) Device Packages
2.3. Power Rails Specification x
2.3.1. Power Nets 2.3.2. Power Rails Tolerance 2.3.3. Power Nets and Transient Specifications
2.3.1. Power Nets x
2.3.1.1. Agilex™ 7 Package Power Nets and Subsystems Details
2.4. Decoupling Capacitors Recommendation x
2.4.1. Agilex™ 7 FPGA Packages Board-Level Decoupling Capacitors Summary 2.4.2. Agilex™ 7 E-Tile Decoupling Capacitors Summary per Tile Agilex™ 7 E-Tile Board-Level Decoupling Capacitors Summary 2.4.3. Agilex™ 7 P-Tile Board-Level Decoupling Capacitors Summary 2.4.4. Agilex™ 7 F-Tile Board-Level Decoupling Capacitors Summary 2.4.5. Agilex™ 7 R-Tile Board-Level Decoupling Capacitors Summary
3. Board Power Delivery Network Recommendations x
3.1. Board Decoupling Capacitors and Power Flooding Guides 3.2. FPGA Core Fabric VCC Voltage Regulator Selection 3.3. Remote Sense Connections 3.4. Load Line Requirements 3.5. VCC Core Board Current Slew Rate
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails x
4.1. P-Tile Rail LC Filter Board Scheme and Connection 4.2. E-Tile Rail LC Filter Board Scheme and Connection 4.3. F-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator 4.4. R-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator
5. PCB PDN Design Guideline for Unused Tiles x
5.1. PDN Design Guideline for Unused E-Tile 5.2. PDN Design Guideline for Unused P-Tile 5.3. PDN Design Guideline for Unused R-Tile 5.4. PDN Design Guideline for Unused F-Tile
1. Agilex™ 7 Power Distribution Network Design Guidelines Overview
2. Power Delivery Overview
3. Board Power Delivery Network Recommendations
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
5. PCB PDN Design Guideline for Unused Tiles
6. PCB Voltage Regulator Recommendation for PCB Power Rails
7. Board Power Delivery Network Simulations
8. Agilex™ 7 Device Family PDN Design Summary
9. Document Revision History for the Agilex™ 7 Power Distribution Network Design Guidelines

2.2. Power-Down Sequencing (PDS)

Power-down sequencing (PDS) is the reverse of power-up sequencing (PUS). Power down has two cases—controlled power down (you do intend to perform power down, reset, or shutdown on the PCB) and uncontrolled power down (you do not intend to power down the PCB but because of malfunction or system failure, this happens).

PDS is always required and recommended in normal operation and controlled power down for the Intel® Agilex™ device family. To perform the PDS in an controlled power-down event, you must follow the reverse for PUS. For more information, refer to the Intel® Agilex™ Device Family Pin Connection Guidelines.

Intel® Agilex™ device family has no uncontrolled PDS requirement for the core or fabric.

E-tile is not PDS-free. You must follow the recommended PDS. PDS is the reverse of PUS. Both VCCH_GXE and VCCCLK_GXE in Group 2 as shown in and must go down before VCC_HSSI_GXE in Group 1. For more information on the recommended power-down circuitry for E-tile in an uncontrolled power-down event, refer to AN 692: Power Sequencing Considerations for Intel® Cyclone® 10 GX, Intel® Arria® 10, Intel® Stratix® 10, and Intel® Agilex™ Devices.

P-tile, R-tile, and F-tile are free of PDS in an uncontrolled power-down event.

The following lists the summary of the Intel® Agilex™ recommended PDS:

  • PDS is required for a controlled power-down event. Follow the reverse of the PUS procedure.
  • PDS is not required but recommended for an uncontrolled power-down event unless it is stated.
    • E-tile requires PDS for an uncontrolled power-down event.
  • All voltage rails must be <100 mV within 1 minute (this applies to a power loss condition as well).
  • If the above condition (<100 mV within 1 minute) is met, then the device reliability is guaranteed, and there will be no device damage or performance degradation.
  • Partial power down is not permitted.
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