3.5.1. Board Connectivity
If you are performing hardware testing on the selected Intel development kits, generate the design example with the appropriate target development kit selected.
Refer to the instructions in Generating the Design.
Note: Running the hardware test with the design generated as-is is only possible when the JESD204C Intel® FPGA IP is configured in duplex data path mode (i.e. with both TX and RX data paths present). Make your own modifications to the design to run the hardware test if generating a simplex data path design.
Port Name | Port Description | Board Component | Component Description |
---|---|---|---|
global_rst_n | Global reset | S8 |
S8 push-button |
refclk_core | Core PLL reference clock input | U3 |
Si5341 clock generator (OUT3) |
refclk_xcvr | Transceiver reference clock input | Engineering sample version board revision A (non-bonded channels) and Production version board revision B (non-bonded channels) | |
U3 |
Si5341 clock generator (OUT8) |
||
Production version board revision B (bonded channels) | |||
U3 |
Si5341 clock generator (OUT4) |
||
mgmt_clk | Control clock | U3 |
Si5341 clock generator (OUT2) (100 MHz) |
tx_serial_data | TX serial data | Engineering sample version board revision A (non-bonded, up to 8 channels) | |
U32-1 |
Intel® Stratix® 10 E-tile banks - 8B (QSFP-DD 1x2) |
||
Engineering sample version board revision A (non-bonded, 9–16 channels) | |||
U32-1 and U75-1 |
Intel® Stratix® 10 E-tile banks - 8B (QSFP-DD 1x2) |
||
Production version board revision B (non-bonded, up to 16 channels) | |||
J27D |
Intel® Stratix® 10 E-tile banks – 8B (FMC+ connector) | ||
Production version board revision B (bonded, up to 4 channels) | |||
U75-1 |
Intel® Stratix® 10 E-tile banks – 9C (QSFP-DD 1x2 connector) | ||
Production version board revision B (bonded, 5–8 channels) | |||
U32-1 and U75-1 |
Intel® Stratix® 10 E-tile banks – 9C (QSFP-DD 1x2 connector) | ||
rx_serial_data | RX serial data | Engineering sample version board revision A (non-bonded, up to 8 channels) | |
U32-1 |
Intel® Stratix® 10 E-tile banks - 8B (QSFP-DD 1x2) |
||
Engineering sample version board revision A (non-bonded, 9–16 channels) | |||
U32-1 and U75-1 |
Intel® Stratix® 10 E-tile banks - 8B (QSFP-DD 1x2) | ||
Production version board revision B (non-bonded, up to 16 channels) | |||
J27D |
Intel® Stratix® 10 E-tile banks – 8B (FMC+ connector) | ||
Production version board revision B (bonded, up to 4 channels) | |||
U75-1 |
Intel® Stratix® 10 E-tile banks – 9C (QSFP-DD 1x2 connector) | ||
Production version board revision B (bonded, 5–8 channels) | |||
U32-1 and U75-1 |
Intel® Stratix® 10 E-tile banks – 9C (QSFP-DD 1x2 connector) | ||
user_led[0] | GPIO- SPI programming done | U39G |
Banks 2 L/M/N ( G31) |
user_dip[0] | GPIO- internal serial loopback enable | U39G |
Banks 2 L/M/N ( G23) |