Quartus® Prime Pro Edition User Guide: Design Constraints

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Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
Answers to Top FAQs 1. Constraining Designs 2. Interface Planning 3. Managing Device I/O Pins 4. Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives A. Quartus® Prime Pro Edition User Guides
1. Constraining Designs x
1.1. Specifying Design Constraints in the GUI 1.2. Constraining Designs with Tcl Scripts 1.3. A Fully Iterative Scripted Flow 1.4. Constraining Designs Revision History
1.1. Specifying Design Constraints in the GUI x
1.1.1. Global Constraints and Assignments 1.1.2. Node, Entity, and Instance-Level Constraints 1.1.3. Probing Between Components of the Quartus® Prime GUI 1.1.4. Specifying Timing Constraints
1.1.2. Node, Entity, and Instance-Level Constraints x
1.1.2.1. Specify Instance-Specific Constraints in Assignment Editor 1.1.2.2. Specify NoC Constraints in NoC Assignment Editor 1.1.2.3. Specify I/O Constraints in Pin Planner 1.1.2.4. Plan Interface Constraints in Interface Planner and Tile Interface Planner 1.1.2.5. Adjust Constraints with the Chip Planner 1.1.2.6. Constraining Designs with the Design Partition Planner
1.1.2.1. Specify Instance-Specific Constraints in Assignment Editor x
1.1.2.1.1. Specifying Multi-Dimensional Bus Constraints
1.1.2.2. Specify NoC Constraints in NoC Assignment Editor x
1.1.2.2.1. NoC Assignment Editor Interface Controls 1.1.2.2.2. Troubleshooting NoC Assignment Editor
1.2. Constraining Designs with Tcl Scripts x
1.2.1. Create a Project and Apply Constraints 1.2.2. Assigning a Pin 1.2.3. Generating Quartus® Prime Settings Files 1.2.4. Synopsys* Design Constraint (.sdc) Files 1.2.5. Tcl-only Script Flows
2. Interface Planning x
2.1. Using Interface Planner 2.2. Using Tile Interface Planner 2.3. Interface Planning Revision History
2.1. Using Interface Planner x
2.1.1. Interface Planner User Interface 2.1.2. Interface Planner General Tool Flow 2.1.3. Interface Planner NoC Tool Flow 2.1.4. Interface Planner Reports
2.1.1. Interface Planner User Interface x
2.1.1.1. Flow Controls 2.1.1.2. Home Tab Controls 2.1.1.3. Assignments Tab Controls 2.1.1.4. Plan Tab Controls 2.1.1.5. Reports Tab Controls
2.1.2. Interface Planner General Tool Flow x
2.1.2.1. Step 1: Setup and Synthesize the Project 2.1.2.2. Step 2: Initialize Interface Planner 2.1.2.3. Step 3: Update Plan with Project Assignments 2.1.2.4. Step 4: Plan Periphery Placement 2.1.2.5. Step 5: Report Placement Data 2.1.2.6. Step 6: Validate and Export Plan Constraints
2.1.2.4. Step 4: Plan Periphery Placement x
2.1.2.4.1. Plan Clock Networks 2.1.2.4.2. Saving & Loading Floorplans
2.1.3. Interface Planner NoC Tool Flow x
2.1.3.1. Placing NoC Design Elements Using Interface Planner
2.1.3.1. Placing NoC Design Elements Using Interface Planner x
2.1.3.1.1. Recommended Placement Order for NoC Elements in Interface Planner 2.1.3.1.2. High-Speed Interconnect NoC Locations in Interface Planner
2.1.4. Interface Planner Reports x
2.1.4.1. Report Summary 2.1.4.2. Report Pins 2.1.4.3. Report HSSI Channels 2.1.4.4. Report Clocks 2.1.4.5. Report Periphery Locations 2.1.4.6. Report Cell Connectivity 2.1.4.7. Report Instance Assignments 2.1.4.8. Report NoC Performance
2.2. Using Tile Interface Planner x
2.2.1. Tile Interface Planner Terminology 2.2.2. Tile Interface Planner Tool Flow 2.2.3. Constraining Dynamic Reconfiguration IP 2.2.4. Tile Interface Planner GUI Reference
2.2.2. Tile Interface Planner Tool Flow x
2.2.2.1. Step 1: Instantiate IP and Run Design Analysis 2.2.2.2. Step 2: Initialize Tile Interface Planner 2.2.2.3. Step 3: Update Plan with Project Assignments 2.2.2.4. Step 4: Create a Tile Plan 2.2.2.5. Step 5: Save Tile Plan Assignments 2.2.2.6. Step 6: Run Logic Generation and Design Synthesis
2.2.2.4. Step 4: Create a Tile Plan x
2.2.2.4.1. Placing IP Components 2.2.2.4.2. Constraining IP Building Blocks
2.2.3. Constraining Dynamic Reconfiguration IP x
2.2.3.1. Defining a Dynamic Reconfiguration Group 2.2.3.2. Assigning Dynamic Reconfiguration Group Placement
2.2.4. Tile Interface Planner GUI Reference x
2.2.4.1. Flow Controls 2.2.4.2. Home Tab 2.2.4.3. Assignments Tab Controls 2.2.4.4. Plan Tab Controls 2.2.4.5. Tcl Console Window
2.2.4.4. Plan Tab Controls x
2.2.4.4.1. Design Tree and Filters 2.2.4.4.2. Reconfiguration Groups View 2.2.4.4.3. Legal Locations Pane
3. Managing Device I/O Pins x
3.1. I/O Planning Overview 3.2. Assigning I/O Pins 3.3. Importing and Exporting I/O Pin Assignments 3.4. Validating Pin Assignments 3.5. Verifying I/O Timing 3.6. Viewing Routing and Timing Delays 3.7. Scripting API 3.8. Managing Device I/O Pins Revision History
3.1. I/O Planning Overview x
3.1.1. Basic I/O Planning Flow 3.1.2. Integrating PCB Design Tools 3.1.3. Intel FPGA Device and I/O Terminology
3.2. Assigning I/O Pins x
3.2.1. Assigning to Exclusive Pin Groups 3.2.2. Assigning Slew Rate and Drive Strength 3.2.3. Assigning I/O Banks 3.2.4. Changing Pin Planner Highlight Colors 3.2.5. Showing I/O Lanes 3.2.6. Assigning Differential Pins 3.2.7. Entering Pin Assignments with Tcl Commands 3.2.8. Entering Pin Assignments in HDL Code
3.2.6. Assigning Differential Pins x
3.2.6.1. Overriding I/O Placement Rules on Differential Pins
3.2.8. Entering Pin Assignments in HDL Code x
3.2.8.1. Using Low-Level I/O Primitives
3.3. Importing and Exporting I/O Pin Assignments x
3.3.1. Importing and Exporting for PCB Tools 3.3.2. Migrating Assignments to Another Target Device
3.4. Validating Pin Assignments x
3.4.1. I/O Assignment Validation Rules 3.4.2. I/O Assignment Analysis 3.4.3. Understanding I/O Analysis Reports
3.4.2. I/O Assignment Analysis x
3.4.2.1. Early I/O Assignment Analysis Without Design Files 3.4.2.2. I/O Assignment Analysis With Design Files 3.4.2.3. Overriding Default I/O Pin Analysis
3.5. Verifying I/O Timing x
3.5.1. Running Advanced I/O Timing 3.5.2. Adjusting I/O Timing and Power with Capacitive Loading
3.5.1. Running Advanced I/O Timing x
3.5.1.1. Board Trace Models 3.5.1.2. Defining the Board Trace Model 3.5.1.3. Modifying the Board Trace Model 3.5.1.4. Specifying Near-End vs Far-End I/O Timing Analysis 3.5.1.5. Advanced I/O Timing Analysis Reports
3.7. Scripting API x
3.7.1. Generate Mapped Netlist 3.7.2. Reserve Pins 3.7.3. Set Location 3.7.4. Exclusive I/O Group 3.7.5. Slew Rate and Current Strength
Answers to Top FAQs
1. Constraining Designs
2. Interface Planning
3. Managing Device I/O Pins
4. Quartus® Prime Pro Edition User Guide: Design Constraints Document Archives
A. Quartus® Prime Pro Edition User Guides

3.4.1. I/O Assignment Validation Rules

I/O Assignment Analysis validates your assignments against the following rules:

Table 34.  Examples of I/O Rule Checks
Rule Description HDL Required?

I/O bank capacity

Checks the number of pins assigned to an I/O bank against the number of pins allowed in the I/O bank.

No

I/O bank VCCIO voltage compatibility

Checks that no more than one VCCIO is required for the pins assigned to the I/O bank.

No

I/O bank VREF voltage compatibility

Checks that no more than one VREF is required for the pins assigned to the I/O bank.

No

I/O standard and location conflicts

Checks whether the pin location supports the assigned I/O standard.

No

I/O standard and signal direction conflicts

Checks whether the pin location supports the assigned I/O standard and direction. For example, certain I/O standards on a particular pin location can only support output pins.

No

Differential I/O standards cannot have open drain turned on

Checks that open drain is turned off for all pins with a differential I/O standard.

No

I/O standard and drive strength conflicts

Checks whether the drive strength assignments are within the specifications of the I/O standard.

No

Drive strength and location conflicts

Checks whether the pin location supports the assigned drive strength.

No

BUSHOLD and location conflicts

Checks whether the pin location supports BUSHOLD. For example, dedicated clock pins do not support BUSHOLD.

No

WEAK_PULLUP and location conflicts

Checks whether the pin location supports WEAK_PULLUP (for example, dedicated clock pins do not support WEAK_PULLUP).

No

Electromigration check

Checks whether combined drive strength of consecutive pads exceeds a certain limit. For example, the total current drive for 10 consecutive pads on a Stratix® II device cannot exceed 200 mA.

No

PCI_IO clamp diode, location, and I/O standard conflicts

Checks whether the pin location along with the I/O standard assigned supports PCI_IO clamp diode.

No

SERDES and I/O pin location compatibility check

Checks that all pins connected to a SERDES in your design are assigned to dedicated SERDES pin locations.

Yes

PLL and I/O pin location compatibility check

Checks whether pins connected to a PLL are assigned to the dedicated PLL pin locations.

Yes
Table 35.  Signal Switching Noise Rules
Rule Description HDL Required?

I/O bank cannot have single-ended I/O when DPA exists

Checks that no single-ended I/O pin exists in the same I/O bank as a DPA.

No

A PLL I/O bank does not support both a single-ended I/O and a differential signal simultaneously

Checks that there are no single-ended I/O pins present in the PLL I/O Bank when a differential signal exists.

No

Single-ended output is required to be a certain distance away from a differential I/O pin

Checks whether single-ended output pins are a certain distance away from a differential I/O pin.

No

Single-ended output must be a certain distance away from a VREF pad

Checks whether single-ended output pins are a certain distance away from a VREF pad.

No

Single-ended input is required to be a certain distance away from a differential I/O pin

Checks whether single-ended input pins are a certain distance away from a differential I/O pin.

No

Too many outputs or bidirectional pins in a VREFGROUP when a VREF is used

Checks that there are no more than a certain number of outputs or bidirectional pins in a VREFGROUP when a VREF is used.

No

Too many outputs in a VREFGROUP

Checks whether too many outputs are in a VREFGROUP.

No
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