Intel(R) Flip Chip Ball Grid Array (FCBGA1, FCBGA3, FCBGA5) Chipsets and Advanced Memory Buffer (AMB), PCN 108251-01, Product Material, solder resist material change, Reason for Revision: Change in substrate delivery schedule

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Intel Desktop Chipsets Intel Mobile Chipsets Intel® Server Chipsets

807213
2008-04-10
Public

Description

Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.

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